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2018 ｜ Journal paper ｜ International Conference ｜


Journal paper

1."Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations"
Takanori Aono, Atsushi Kazama, Ryoji Okada, Tomio Iwasaki and Yoshitada Isono
Journal of Micromechanics and Microengineering, Vol.28, No.3, 035004 (11p), 2018. [Abstract]
(doi.org/10.1088/1361-6439/aaa2d8)

2."Nanotemplate-guided self-assembly of gold nanoparticles and its application to plasmonic bio/chemical sensing"
Koji Sugano
International Journal of Automation Technology, Vol.12, No.1, pp.79-86, 2018. [Abstract]
(doi.org/10.20965/ijat.2018.p0079)

International Conference

1. "A Novel 3-axis Tiny Tactile Sensor Developed by 3-D Microstructuring Using Punch Creep Forming Process"
K. Osaka, S. Nakata, K. Yamamoto, T. Toyoda, Koji Sugano, and Yoshitada Isono
The 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS2018), Belfast, Northern Ireland, UK, Jan. 21-25 2018, T-200.

2. "Surface-Enhanced Raman Spectroscopy of DNA Bases Using Gold Nanoparticle Dimer Array"
Katsunari Maruoka, Kohei Ikegami, Akio Uesugi, Koji Sugano, Yoshitada Isono
31st International Microprocesses and Nanotechnology Conference (MNC2018), Sapporo Park Hotel, Sapporo, Japan, Nov. 13-16 2018, 15P-7-84 (2p).

3. "Development of 3D Formed Tactile Sensor by High Temperature Punch Creep Forming Technique"
Kyosuke Nimura, Kenji Osaka, Takao Toyoda, Akio Uesugi, Koji Sugano, Yoshitada Isono
31st International Microprocesses and Nanotechnology Conference (MNC2018), Sapporo Park Hotel, Sapporo, Japan, Nov. 13-16 2018, 14C-2-6 (2p).